View BD82007FVJ-M_8665398.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

datashee t product structu re silicon monolithic integrated circuit this product has not designed protection against radioactive r ays 1/ 23 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 05.feb.2015 rev.001 tsz02201-0ggg0h300020-1-2 1ch high side switch ics 2.4a current limit high side switch ics bd820 06 fvj-m bd820 07 fvj-m general description bd82006fvj-m and BD82007FVJ-M are low on -resistance n-channel mosfet high -side power switches opt imized for universal serial bus (usb) applications. bd82006fvj-m and BD82007FVJ-M are equipped with the function of over-current protection, thermal shutdown, under-voltage lockout and soft-start. features ? aec -q100 qualified ? built-in low on-resistance (typ 70 m) n-channel mosfet ? current limit threshold 2.4a ? over-current protection ? thermal shutdown ? open-drain fault flag output ? under-voltage lockout protection ? soft-start circuit ? reverse current protection w hen power switch off ? control input logic ? active-high : bd82006fvj-m ? active- low : BD82007FVJ-M ? ttl enable input applications car accessory key specifications ? input voltage range: 2.7v to 5.5 v ? on -resistance: 70 m (typ) ? over-current threshold: 1.5 a (m in ) , 3.0 a (m ax ) ? number of channels: 1ch ? output rise time: 0.8ms(typ) ? standby current: 0.01a ( typ) ? operating temperature range: - 40 c to +85c package w(typ) d(typ) h (max) typical application circuit lineup current limit threshold co ntrol input l ogic package orderable part number min typ max 1.5a 2.4a 3.0a high tssop-b8j reel of 25 00 bd82006fvj-mg e2 1.5a 2.4a 3.0a low tssop-b8j reel of 25 00 bd8 200 7fvj-mg e2 ts sop-b8j 3.00mm x 4.90mm x 1.10mm out out out in in /oc gnd 5v(typ.) c l c i n - + en(/en) 3.3v 10k ~ 100k v out 10k to 100k 5v(typ) downloaded from: http:///
2/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m block diagram uvlo in gnd charge pump gate logic ocd tsd in en /en out out out /oc pin configurations 1 2 3 4 8 7 6 5 en gnd in in out out out /oc 1 2 3 4 8 7 6 5 / en gnd in in out out out /oc pin description pin no. symbol i / o function 1 gnd - ground. 2, 3 in - switch input and the supply voltage for the ic. at use, connect both pin s together. 4 en , /en i enable input. en: high level input turns on the switch .( bd82006fvj-m) /en: low level input turns on the switch .( BD82007FVJ-M) high level input > 2.0v, low level input < 0.8v. 5 /oc o over-current detection terminal. low level output during over-current or over-temperature conditio n. open-drain fault flag output. 6, 7, 8 out o power switch output. at use, connect each pin together. bd82006fvj-m top view BD82007FVJ-M top view downloaded from: http:///
3/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage v in -0.3 to +6.0 v enable input voltage v en , v /en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 t o +6.0 v storage temperature tstg -55 to + 150 c power dissipation pd 0.58 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 4.7mw/c above ta=25c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max operating v ol tage v in 2.7 - 5.5 v op erating temperature t opr - 40 - + 85 c electrical characteristics bd82006fvj-m (v in =5.0v, ta=25c , unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v en = 5v , out=open standby current i stb - 0.01 1 a v en = 0v , out=open en input voltage v en h 2.0 - - v high input v en l - - 0.8 v low i nput en input current i en -1.0 +0.01 +1.0 a v en = 0v or v en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak current i l /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 70 110 m i out = 500ma switch leak current i l sw - - 1.0 a v en = 0v, v out = 0v reverse leak current i lrev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47f (rms) output rise time t on1 - 0.8 10 ms r l = 10 output turn on time t on2 - 1.1 20 ms r l = 10 output fall time t off1 - 5 20 s r l = 10 output turn off time t off2 - 10 40 s r l = 10 uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing downloaded from: http:///
4/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m electrical characteristics C continued BD82007FVJ-M (v in =5.0v, ta=25c, unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v /e n = 0v , out=open standby current i stb - 0.01 1 a v /e n = 5v , out=open /en input voltage v /e nh 2.0 - - v high input v /e nl - - 0.8 v low i nput /en input current i /e n -1.0 +0.01 +1.0 a v /e n = 0v or v /e n = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak current i l /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 70 110 m i out = 500ma switch leak current i l sw - - 1.0 a v /e n = 5v , v out = 0v reverse leak current i lrev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47f (rms) output rise time t on1 - 0.8 10 ms r l = 10 output turn on time t on2 - 1.1 20 ms r l = 10 output fall time t off1 - 5 20 s r l = 10 output turn off time t off2 - 10 40 s r l = 10 uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing downloaded from: http:///
5/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m measurement circuit gnd in in en(/en) out out out /oc v en (v /en ) 1f v in a gnd in in en(/en) out out out /oc v en (v /en ) 1f r l c l v in 10k v in a a. operating current b. en (/en) input voltage, output rise / fall time inrush current gnd in in en(/en) out out out /oc v en (v /en ) 1f 10k c l v in v in i out a gnd in in en(/en) out out out /oc v en (v /en ) 1f v in v in i /oc c. on -resistance, over-current detection d. /oc output low voltage figure 1. measurement circuit timing diagram t on1 v out 10% 90% 90% t off1 t on2 v en v en h t off2 v en l t on1 v out 10% 90% 90% t off1 t on2 v /e n v /e nl t off2 v /enh figure 2. timing d iag ram figure 3. timing diagram (bd82006fvj-m) (BD82007FVJ-M) t o ff2 t o ff2 t on 2 t on 2 t o ff1 t o ff 1 downloaded from: http:///
6/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves figure 6. standby current vs supply voltage (en, /en disable) figure 4. operating current vs supply voltage (en, /en enable) figure 5. operating current vs ambient temperature (en, /en enable) figure 7. standby current vs ambient temperatuire (en, /en disable) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a] ta=25c 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[] operating current : i dd [a] v in =5.0v 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25c 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[] standby current : i stb [a] v in =5.0v downloaded from: http:///
7/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued figure 8. en, /en input voltage vs supply voltage figure 9. en, /en input voltage vs ambient temperature figure 1 0. on-resistance vs supply voltage figure 11. on-resistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[] on resistsnce : r on [m] v in =5.0v 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistsnce : r on [m] ta=25c 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] low to high high to low ta=25c enable input voltage : v en, v / en [v] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[] enable input voltage : v en [v] v in =5.0v high to low low to high enable input voltage : v en, v / en [v] downloaded from: http:///
8/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued figure 12. current limit threshold vs supply voltage figure 13. current limit threshold vs ambient temperature figure 14. short circuit current vs supply voltage figure 15. short circuit current vs ambient temperature 1.4 1.6 1.8 2.0 2.2 2.4 2 3 4 5 6 supply voltage : v in [v] current limit threshold : i th [a] ta=25c 1.4 1.6 1.8 2.0 2.2 2.4 -50 0 50 100 ambient temperature : ta[] current limit threshold : i th [a] v in =5.0v 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 ambient temperature : ta[] short-circuit current : i sc [a] v in =5.0v 1.0 1.2 1.4 1.6 1.8 2.0 2 3 4 5 6 supply voltage : v in [v] short-circuit current : i sc [a] ta=25c downloaded from: http:///
9/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage : v hys [v] figure 16. /oc output low voltage vs supply voltage figure 17. /oc output low voltage vs ambient temperature figure 18. uvlo threshold voltage vs ambient temperature figure 19. uvlo hysteresis voltage vs ambient temperature 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage: v /oc [mv] ta=25c 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[] /oc output low voltage: v /oc [mv] v in =5.0v 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[] uvlo threshold: v tuvh , v tuvl [v] v tuvh v tuvl downloaded from: http:///
10 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued figure 22. output turn on time vs supply voltage figure 23. output turn on time vs ambient temperature figure 20. output rise time vs supply voltage figure 21. output rise time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output rise time : t on1 [ms] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature: ta[] output rise time : t on1 [ms] v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output turn on time : t on2 [ms] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] output turn on time : t on2 [ms] v in =5.0v downloaded from: http:///
11 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued 0.0 2.0 4.0 6.0 8.0 10.0 2 3 4 5 6 supply voltage : v in [v] output turn off time : t off2 [s] ta=25c figure 26. output turn off time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output fall time : t off1 [s] ta=25c fi gure 24. output fall time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] output fall time : t off1 [s] v in =5.0v figure 25. output fall time vs ambient temperature 0.0 2.0 4.0 6.0 8.0 10.0 -50 0 50 100 ambient temperature : ta[ ] output turn off time : t off2 [s] v in =5.0v figure 27. output turn off time vs ambient t em perature downloaded from: http:///
12 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical performance curves - continued /oc delay time : t /oc [ms] /oc delay time : t /oc [ms] figure 28. /oc delay time vs supply voltage figure 29. /oc delay time vs ambient temperature 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] ta=25c 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[] v in =5.0v downloaded from: http:///
13 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical wave forms (bd82006fvj-m) v en (5v/div.) v in =5v r l =5 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (1.0a/div.) time(1ms/div.) figure 30. output ri se characteristic v en (5v/div.) v in =5v r l =5 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (1.0a/div.) time(1ms/div.) figure 31. output fall characteristic v en (5v/div.) v in =5v r l =5 v /oc (5v/div.) i in (1.0a/div.) c l =47f c l =100f c l =220f time(1ms/div.) figure 32. inrush current response v in =5v c l =100 f v out (5v/div.) v /oc (5v/div.) i out (1.0a/div.) time(10ms/div.) figure 33. over-c ur rent response ramp ed load downloaded from: http:///
14 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical wave forms - continued time(2ms/div.) figure 34. over-current response ramp ed load i out (1.0a/div.) v out (5v/div.) v /oc (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v c l =100 f time(5ms/div.) figure 36. over-current re sponse 1 lo ad connecte d at enable v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) thermal shutdown time(200ms/div.) figure 37. thermal shutdown 1 load connected at enable v en (5v/div.) v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) time(5ms/div.) figure 35. over-current response enable to short-circuit v in =5v c l =100 f downloaded from: http:///
15 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical wave forms - continued v in (5v/div.) r l =5 c l =100 f v out (5v/div.) v /oc (5v/div.) i out (1.0a/div.) time(10ms/div.) figure 38. uvlo response when increasing v in v in (5v/div.) r l =5 c l =100 f v out (5v/div.) v /oc (5v/div.) i out (1.0a/div.) time(10ms/div.) figure 39. uvlo response when decreasing v in downloaded from: http:///
16 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m typical application circuit in out regulator out out out in in /oc gnd vbus d- d+ gnd usb controller 5v(typ) 10k to 100k c l c in - + en(/en) application information when excessive current flows due to output short circuit or so, ringing occurs by inductance of power source lin e and ic . this may cause bad effects on ic operations. in order to av oid this case, a bypa ss capacitor (c in ) should be connected across the in terminal and gnd terminal of ic. a 1f or higher value is recommended. moreover, in order to de crease voltage fluctuations of power source line and ic , connect a low esr capacitor in parallel with c in. a 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k to 100k. set up values for c l which satisfies the application. this application circuit does not guarantee its operati on . when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including ac/dc characteristics as well as dispersio n of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain an d the source of mosfet switch respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en(/en) control input, in and out terminals are connected by a 70m (typ ) switch . in on status, the switch is bidirectional. therefore, when the potential of out terminal is higher than that of in terminal, current flows from out to in terminal. on the other hand, when the switch is turned off , it is possible to prevent current from flowing reversely from out to in terminal s ince a parasitic diode between the drain and the source of switch mosfet is not present. 2. thermal shutdown circuit (tsd) if over-current would continue, the temperature of the ic would increase drastically. if the junction temperature were beyond 170c (t yp ) in the condition of over-current detection, thermal shutdown circuit operates and turns the power switch off, causing the ic to output a fault flag (/oc). then, wh en the junction temperature decreases lower than 150 c (t yp ), the power switch is turned on and the fault flag (/oc) is cancelled. this operation repeats , unless the increase of chip s temperature is removed or the output of power switch is turned off. the thermal shutdown circuit operates when the switch is on (en (/en) signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each s witch mosfet exceeds a specified value. the over-current detection circuit works when the switch is on (en(/en) signal is active). there are three types of response against over-curren t: (1) when the switch is turned on while the output is in short circuit status, the switch g oe s in to current limit status immediately. (2) when the output short-circuits or high-current load is connected while the switch is on , very large current flows until the over-current limit circuit reacts. when the current detection and limit circuit operates, current limitation is carried out. (3) when the output current increases gradually, current limi tation would not operate unless the output current exceeds the over-current detection value. when it exceeds th e detection value, current limitation is carried out. c in downloaded from: http:///
17 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while th e switch is still on , then uvlo shuts off the power switch. uvlo has a hysteresis of 10 0mv(typ ). under-voltage lockout circuit operates when the switch is on (en( /en) signal is active). 5. fault flag (/oc) output fault flag output is n-mos open drain output. during detection of over-current and/or thermal shutdown, the output level will turn low. over-current detection has delay filter. this delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at switch on or during hot plug. if fault flag output is unused, /oc pin should be connected to ground line or open. v en v out i out v /oc output shortcircuit thermal shut down /oc delay time figure 40. over-current detection, thermal shutdown timing (bd82006fvj-m) v /en v out i out v /oc output shortcircuit thermal shut down /oc delay time figure 41. over-current detection, thermal shutdown timing (BD82007FVJ-M) v /en v out i out v /oc output short circuit thermal shutdown v en v out i out v /oc output short circuit thermal shutdown downloaded from: http:///
18 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m power dissipation (tssop-b8j) mounted on 70mm x 70mm x 1.6mm glass epoxy board. figure 42. power dissipation curve (pd -ta curve) i/o equivalen ce circuit symbol pin no equivalen ce circuit en(/en) 4 /oc 5 out 6,7,8 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw] power dissipation: pd[mw] ambient temperature: ta[ c] downloaded from: http:///
19 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is wh en the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. in r ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfuncti on . 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power s upply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a sign ificant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
20 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m op erational notes - continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor . parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 43 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be wi thin the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the power dissipatio n (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
21 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m ordering information b d 8 2 0 0 6 f v j - m g e 2 part number package fvj : tssop-b8j product rank m: for automotive packaging and forming specification g : halogen free e2: embossed tape and reel b d 8 2 0 0 7 f v j - m g e 2 part number package fvj : tssop-b8j product rank m: for automotive packaging and forming specification g : halogen free e2: embossed tape and reel marking diagram part number part number marking bd82006fvj-m d820 06 BD82007FVJ-M d820 07 tssop-b8j (top view) part number marking lot number 1pin mark downloaded from: http:///
22 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m physical dimension, tape and reel information package name tssop-b8j downloaded from: http:///
23 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300020-1-2 bd82006fvj-m bd820 07 fvj-m revision history date revision changes 05 .feb.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD82007FVJ-M

	To Download BD82007FVJ-M Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .